Memory Specifications. Max Memory Size dependent on memory type. Memory Types. Max of Memory Channels. Max Memory Bandwidth. Physical Address Extensions. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support. Processor Graphics.
Graphics Output. Expansion Options. PCI Express Revision. Package Specifications. Max CPU Configuration. Cores is a hardware term that describes the number of independent central processing units in a single computing component die or chip. Processor Base Frequency describes the rate at which the processor's transistors open and close.
The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz GHz , or billion cycles per second. CPU Cache is an area of fast memory located on the processor.
A bus is a subsystem that transfers data between computer components or between computers. Thermal Design Power TDP represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload.
Refer to Datasheet for thermal solution requirements. VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions.
See your Intel representative for details. The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Highly threaded applications can get more work done in parallel, completing tasks sooner. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. Idle States C-states are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work.
C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states. Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features.
An on-die Digital Thermal Sensor DTS detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits. It enables an environment where applications can run within their own space, protected from all other software on the system.
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support.
Contact your OEM or reseller for warranty support. What is the difference between Boxed and Tray Processors? Supplemental Information. Embedded Options Available. View now. Package Specifications.
Sockets Supported. Package Size. Processing Die Size. Advanced Technologies. Highly threaded applications can get more work done in parallel, completing tasks sooner. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions. Instruction Set. Idle States. Thermal Monitoring Technologies. It enables an environment where applications can run within their own space, protected from all other software on the system.
Refer to Datasheet for formal definitions of product properties and features. Please refer to the Launch Date for market availability.
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